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APPLYING OUR HEAT TRANSFERS
INK SYSTEM
TEMP
DWELL
PRESSURE
Hot Peel 360-375 F
7-10 sec
50-80 PSI
Colorbright 365 F
7-10 sec
40-60 PSI
Puff 365 F
7-8 sec
40-60 PSI
NCM 335-350 F
7-15 sec
40-60 PSI
Sublimation 375-400 F
35-40 sec
35-50 PSI
DirecTrans 360-375 F 7-10 sec 50-80 PSI
Print-A-Stitch 365 F 7-8 sec 40-60 PSI
M-Print 250-340 F 4-8 sec 40-80 PSI

HOT PEEL:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately. Transfer paper will not be "clean". May be allowed to cool slightly for greater opacity or for very detailed design or for 4-color design.

COLORBRIGHT:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately.

PUFF:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately.

NCM:

Preheat substrate and apply transfer in accordance with the specifications above. Allow to cool for 5-10 seconds and remove transfer paper.

SUBLIMATION:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately.

DIRECTRANS:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately. Transfer paper will not be "clean". May be allowed to cool slightly for greater opacity or for very detailed design or for 4-color design.

PRINT-A-STITCH:

Preheat substrate and apply transfer in accordance with the specifications above. Remove transfer paper immediately.

M-PRINT:

ALWAYS SET TIME, TEMPERATURE, AND PRESSURE USING AN EXTRA SUBSTRATE PIECE BEFORE BEGINNING PRODUCTION RUN.
The application temperature and pressure is determined by the tolerance of the substrate. It is best to start low and increase until application is satisfactory.

1. Temperature: 250 degrees to 340 degrees
2. Cover substrate with Teflon sheet and preheat substrate
3. Place transfer on substrate and cover with Teflon sheet
4. Apply for 4 to 8 seconds using 40 to 80 psi
5. Allow to cool completely
6. Some substrates may require covering with Teflon and reapplying transfer again (i.e. in cases that a paper mark is left on the substrate or when the substrate has stretching properties).